Soldertec Global and Global SMT & Packaging are delighted to announce the publication of the agenda for the European Conference on ‘Reliability in Electronic Assemblies’. This conference, which is sponsored by metals group Balver Zinn, will be held at the Tallink Spa and Conference Hotel in Tallinn, Estonia, from 22nd to 24th October 2008. There will be in depth training workshops from US reliability guru Werner Engelmaier, Dr Thomas Ahrens from Fraunhofer ISIT and SMT specialist Bob Willis.

Key industry experts will give presentations over the course of this two day conference, including speakers from Siemens and Thales. The supply chain will be represented with discussions from Zestron, Rohm & Haas, Atotech, Dage and Cobar. There will also be presentations on research papers by The University of Bordeaux, Fraunhofer, IMEC, TNO and SINTEF. This technical conference will be covering reliability in specific industry sectors, such as design for reliability; production and material advancements; new inspection techniques and component issues.

“It is over two years since the RoHS deadline of July 2006 changed forever the way in which electronic products are assembled and sold within international markets. However, important reliability issues with the new technologies still remain unsolved,” comments Dr Jeremy Pearce, Technology Networks Manager, at Soldertec Global. “This conference aims to deliver answers to these issues by listening to international expert speakers and by giving the opportunity for delegates to network during this two day event.”

Further details are available from the conference website: www.europeanelectronicsummit.com