Soldertec Global and Global SMT & Packaging are delighted to announce that a European and International Conference on ‘Reliability in Electronic Assemblies’ will be held at the Tallink Spa & Conference Hotel in Tallinn, Estonia, October 22nd – 24th 2008. The two day conference will be preceded by training workshops from top trainers in their field.
It is over two years since the RoHS deadline of July 2006 changed forever the way electronic products are assembled and sold in international markets. Important reliability issues with the new technologies remain unsolved. This event brings together experts in a unique opportunity to tackle this business-critical topic through industry discussion, technical collaboration, and information sharing. There are also opportunities for highlighting reliability solutions through event sponsorship, and exhibition space for tabletop displays.
To submit a presentation or training course topic for this conference, speakers should send an abstract (200 to 300 words) along with a brief biography and a completed submission form to: tom.perrett@itri.co.uk. The deadline for abstract submission is 10th July 2008.
“This technical conference is being held at a critical time for the electronics industry. New assembly methods and materials have introduced uncertainties about long term reliability, especially in harsh environments that need urgent and complex technical solutions,” comments Dr Jeremy Pearce, Technology Networks Manager, at Soldertec Global. “Whilst part of the industry adapts to rapidly multiplying international environmental legislation, another part of our industry becomes uneasy with growing pressures to conform through changes in the supply chain, customer demands for sustainable products and the possible loss of RoHS exemptions by 2010. At the same time new reliability challenges have emerged through advances in component design and the proliferation of counterfeit components for example.”
“However it is not all bad news. Major consortia and experienced players are working hard to provide answers and these efforts are now starting to bear fruit. Entirely new materials and assembly technologies are being developed, including nanosolders,” continues Dr Jeremy Pearce. “Are these pie-in-the-sky or real world solutions? With delegates and speakers from around the world, this event will provide great opportunities to hear the real story and network with industry experts during three days at a top class venue.”
The conference will be held in the beautiful medieval Baltic City of Tallinn in Estonia. The conference hotel is situated in the city centre, close to the old town, restaurants and attractions of this small but historic city.
Papers from technical experts are sought on any subject relevant to reliability, including; reliability in specific industry sectors; design for reliability; production and material advancements; new inspection techniques, component issues, research consortia updates, and environmental policy development around the world.
Information on the exhibiting opportunities is available from Global SMT & Packaging.
Please contact:
Europe- Andy Kellard: akellard@globalsmt.net
Americas- Lino D’Andreti: ldandreti@globalsmt.net
Asia- Amanda Tan: atan@globalsmt.net
Further details are available from the conference website
www.europeanelectronicsummit.com |
